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Breakthroughs in MEMS Devices Encapsulation

With support of the 863 Program, the precision positioning research for MEMS (Micro Electromechanical System) witnessed breakthroughs in the field of advanced manufacturing and automation.

The research team has applied for four national invention patents. Aside from the needs for MEMS connection and assembly, related technologies boast bright future for application in IC encapsulation, bio-chips and so on.